Tim has many years’ experience in the field of electronics packaging, covering the key disciplines of Mechanical design, Printed Circuit Board layout and Cable design.

Mechanical:

Electronics Packaging

EMC Protection

Technologies:

• Sheet Metal
• Extrusion
• Machining
• Sand- & Die-Casting
• Injection, Structural Foam & Vacuum-Formed Plastics Mouldings
• Polycarbonate & Polyester overlays

Printed Circuit Board:

Schematic Entry

PCB Layout

Technologies:

• Electro-Mechanical integration
• Through-Lead, Surface-Mount, Press-Fit & Through-Hole Reflow Devices
• Single-Sided, Multi-Layer & Carbon Print Printed-Circuit Boards, and Flexible & Flex-Rigid Circuits
• Digital, Analogue, UHF & RF board-layout features

Cables and Wiring:

Mains & DC Distribution

Multi-Core

Insulation Displacement

RF